On July 27, South Korea announced a landmark $950 billion AI semiconductor industry collaboration following President Lee Jae-myung's summit in San Francisco, involving Samsung, SK Group, and multiple U.S. tech giants. The deals aim to secure global chip supply and accelerate advanced AI system development.

The package comprises two core agreements. SK Group signed $750 billion in total**, with **SK Hynix and NVIDIA locking in over $500 billion in long-term HBM memory supply and joint development for AI training, AI agents, and physical AI applications. Samsung Electronics signed a five-year strategic MOU with Broadcom worth $200 billion, covering memory chips, foundry (including 2nm and below advanced processes), and 2.3D/2.5D advanced packaging.

For Samsung and Broadcom, the partnership extends beyond supply into technology co-development and capacity binding – spanning customized memory for AI accelerators, advanced wireless chips, and high-performance, low-power packaging solutions.

SK Hynix also committed to doubling its wafer capacity by 2030 to match NVIDIA’s chip iteration cycles, ensuring seamless supply for AI servers, robots, and supercomputers.

From ICgoodFind: $950 billion ties the Korean memory giants to U.S. AI demand for a decade. With HBM as the bottleneck and NVIDIA as the anchor, South Korea just placed itself at the center of the global AI hardware supply map.